Equipment & machinery · Netherlands

BE Semiconductor Industries (Besi)

The leading maker of die-attach and hybrid-bonding systems; its tools are used for 3D chip stacking at TSMC, Intel and the memory makers.

Headquarters
Duiven, Netherlands · Europe
Value chain
Equipment & machinery(Tools)
What that means
Builds the machines that make things: production, test and measurement equipment, machine tools, printers and lab instruments.
Founded
1995
Ownership
Listed
Listing
Euronext Amsterdam:BESI on Google Finance
Website
besi.com
Relevance
High at its strongest, in Advanced Packaging & Heterogeneous Integration

In 2 capabilities

Each capability the company is listed in, most relevant first: how experts in the field see its global relevance there, why it is listed and the source.

  1. Semiconductors & Advanced Computing · Equipment & materials · listed #9 of 50

    The leading maker of die-attach and hybrid-bonding systems; its tools are used for 3D chip stacking at TSMC, Intel and the memory makers.

    Relevance: Leading hybrid-bonding and die-attach equipment maker

    Source · besi.com

  2. Semiconductors & Advanced Computing · Equipment & materials · listed #30 of 50

    Leader in die-attach and hybrid-bonding equipment for advanced packaging, partnered with Applied Materials on hybrid bonding.

    Relevance: Leader in die-attach and hybrid bonding equipment

    Source · en.wikipedia.org