GINC Technology
Semiconductors & Advanced Computing

Advanced Packaging & Heterogeneous Integration

The capacity to assemble, package and integrate semiconductors at the frontier: advanced packaging, chiplet architectures and heterogeneous integration, where system performance is increasingly won.

Capability group
Semiconductors & Advanced Computing
Domain
Critical Technology · Hard Power
Identifier
factbase.org/cap/ZN3NJYQW68

Papers

–

2020–2024

Paper growth

–

2020–24 on 2015–19

Patent families

89.4k

2020–2024

Filed abroad

53%

families in more than one office

Framework

What it covers

What the capability covers and what it leaves to others, and the indicators it will be measured by.

Bounds

Covers packaging and integration technology; assembly plants belong to Strategic Infrastructure, and the migration of frontier value into this stage reads across its make and control layers.

Lineage

New in v0.1; added because the performance frontier has moved beyond transistor scaling into integration, and a value-chain structure without this stage would misread where position is now contested.

Indicators

  • advanced packaging capacity sharePending
  • assembly and test revenue sharePending
Research

Who publishes it

No research data maps to this capability yet: it is new in framework v0.1 and the research classification still follows the v0.0 topics.

Patents

Who patents it

Patent families by the nation of origin of their applicants and their earliest priority year, from the CPC and IPC classes the capability is read from. 2025 onwards is incomplete: families are published 18 months after priority.

Families by priority year

The five leading origins, families by year

16,275 applicants filed here in 2015–2024; the five largest held 14% of families (HHI 69 of 10,000: unconcentrated).

Share of families by origin, 2020–2024

  1. 1China36.8%32,916 families
  2. 2Japan18.1%16,190 families
  3. 3South Korea14.6%13,015 families
  4. 4United States12.1%10,820 families
  5. 5Taiwan10.3%9,247 families
  6. 6Germany3.3%2,912 families
  7. 7Singapore0.9%811 families
  8. 8France0.8%712 families
  9. 9Netherlands0.6%532 families
  10. 10Switzerland0.5%422 families

Applicants filing most internationally, 2015–2024

Families filed in more than one office, by applicant as the offices name them.

  1. 1SAMSUNG ELECTRONICS CO LTD6,808international families
  2. 2TAIWAN SEMICONDUCTOR MFG CO LTD4,301international families
  3. 3SAMSUNG DISPLAY CO LTD2,524international families
  4. 4INTEL CORP2,029international families
  5. 5MITSUBISHI ELECTRIC CORP1,644international families
  6. 6TAIWAN SEMICONDUCTOR MFG1,524international families
  7. 7BOE TECHNOLOGY GROUP CO LTD1,246international families
  8. 8MURATA MANUFACTURING CO1,245international families
  9. 9INFINEON TECHNOLOGIES AG1,169international families
  10. 10ROHM CO LTD987international families

Classification read

  • H10W Semiconductor packages, interposers, bonding, encapsulation and thermal control · 10m documents
  • H10B80/00 Stacked and assembled memory packages · 12.3k documents
  • H10D80/00 Assemblies of multiple semiconductor devices · 4k documents

Shares inventions with

Capabilities whose classes the same families also fall in, by overlap (Jaccard).

Companies

Who makes it

The companies that research, design, make, supply and operate the technology, the global leaders and the leading firms of every region.

50 companies in this capability, from 17 nations across 6 regions. Sorted by how experts see each company's global relevance in the field, from very high to very low.

  1. Very high4 companies
  2. 1

    TaiwanTSMC

    Runs the 3DFabric platform (CoWoS, InFO, SoIC) that packages almost every leading AI accelerator, including Nvidia and AMD GPUs, and is the largest holder of advanced-packaging capacity.

    Very high relevance · Contract manufacturing · Taiwan, Hsinchu · founded 1987 · 84k staff

  3. 2

    TaiwanASE Technology Holding

    The world's largest OSAT (it includes SPIL), offering fan-out, 2.5D/3D, SiP and its VIPack chiplet-integration platform, and adding CoWoS-type capacity for AI chips.

    Very high relevance · Contract manufacturing · Taiwan, Kaohsiung · founded 1984

  4. 3

    United StatesAmkor Technology

    The second-largest OSAT, supplying 2.5D, fan-out, flip-chip and SiP packaging, and building a CHIPS Act-funded advanced-packaging campus in Peoria, Arizona that will serve Apple and TSMC.

    Very high relevance · Contract manufacturing · United States, Tempe · founded 1968 · 29k staff

  5. 4

    United StatesIntel

    Developed EMIB and Foveros 3D stacking, led the UCIe chiplet standard and sells advanced packaging as a foundry service from sites in New Mexico, Malaysia and elsewhere.

    Very high relevance · Components & subsystems · United States, Santa Clara · founded 1968 · 109k staff

  6. High8 companies
  7. 5

    South KoreaSamsung Electronics

    Combines HBM memory stacking with its I-Cube (2.5D) and X-Cube (3D) foundry packaging, and is the largest international patent applicant in this capability.

    High relevance · Components & subsystems · South Korea, Suwon · founded 1969 · 268k staff

  8. 6

    South KoreaSK hynix

    The leading HBM supplier; its MR-MUF through-silicon-via die stacking is central to AI-accelerator packages, and it is building an advanced-packaging plant in West Lafayette, Indiana.

    High relevance · Components & subsystems · South Korea, Icheon · founded 1983

  9. 7

    ChinaJCET Group

    China's largest OSAT and third worldwide (it owns STATS ChipPAC), with the XDFOI chiplet/2.5D platform in volume production.

    High relevance · Contract manufacturing · China, Jiangyin · founded 1972

  10. 8

    United StatesApplied Materials

    The largest supplier of wafer-level packaging equipment (deposition, etch, plating, hybrid-bonding tools with BESI), and it runs a dedicated heterogeneous-integration R&D centre.

    High relevance · Equipment & machinery · United States, Santa Clara · founded 1967 · 36k staff

  11. 9

    NetherlandsBE Semiconductor Industries (Besi)

    The leading maker of die-attach and hybrid-bonding systems; its tools are used for 3D chip stacking at TSMC, Intel and the memory makers.

    High relevance · Equipment & machinery · Netherlands, Duiven · founded 1995

  12. 10

    JapanDisco Corporation

    Dominates precision dicing, grinding and thinning equipment, which every HBM stack and 2.5D/3D package depends on.

    High relevance · Equipment & machinery · Japan, Tokyo · founded 1937

  13. 11

    JapanIbiden

    A top maker of the high-layer-count ABF IC substrates used for Intel, Nvidia and AMD processors and AI packages.

    High relevance · Components & subsystems · Japan, Ogaki · founded 1912

  14. 12

    JapanAjinomoto

    Holds a near-monopoly on Ajinomoto Build-up Film (ABF), the insulating material in virtually all high-performance flip-chip substrates.

    High relevance · Chemicals & gases · Japan, Tokyo · founded 1909

  15. Moderate20 companies
  16. 13

    ChinaTongfu Microelectronics

    A top-five global OSAT and AMD's main back-end partner (through the former AMD Penang and Suzhou plants), offering chiplet and 2.5D packaging.

    Moderate relevance · Contract manufacturing · China, Nantong · founded 1997

  17. 14

    SingaporeASMPT

    One of the largest back-end equipment makers, supplying thermo-compression and hybrid bonders for HBM and chiplet assembly as well as die-attach and wire-bonding tools.

    Moderate relevance · Equipment & machinery · Singapore, Singapore · founded 1975

  18. 15

    South KoreaHanmi Semiconductor

    The leading supplier of the thermo-compression bonders SK hynix and Micron use to stack HBM dies.

    Moderate relevance · Equipment & machinery · South Korea, Incheon · founded 1980

  19. 16

    JapanTokyo Electron

    Supplies wafer bonding, debonding and laser lift-off systems for 3D integration and backside power delivery.

    Moderate relevance · Equipment & machinery · Japan, Tokyo · founded 1963

  20. 17

    United StatesAMD

    Brought chiplet architectures into high-volume production (EPYC, Ryzen, the Instinct MI300) and was first to ship hybrid-bonded 3D V-Cache.

    Moderate relevance · Design · United States, Santa Clara · founded 1969 · 28k staff

  21. 18

    United StatesMicron Technology

    Stacks HBM3E memory for Nvidia accelerators and is building HBM packaging capacity in Taiwan, Singapore and its Sanand ATMP plant in India.

    Moderate relevance · Components & subsystems · United States, Boise · founded 1978 · 48k staff

  22. 19

    TaiwanPowertech Technology

    The largest memory-focused OSAT, developing panel-level fan-out and chip-on-wafer-on-substrate (CoWoS)-type packaging for logic and memory.

    Moderate relevance · Contract manufacturing · Taiwan, Hsinchu · founded 1997

  23. 20

    ChinaTianshui Huatian Technology

    China's third-largest OSAT, offering fan-out, TSV and 2.5D packaging; it also controls Malaysia's Unisem.

    Moderate relevance · Contract manufacturing · China, Tianshui · founded 2003

  24. 21

    TaiwanUnimicron Technology

    The world's largest ABF substrate maker by revenue, and a key substrate supplier for AI and HPC packages.

    Moderate relevance · Components & subsystems · Taiwan, Taoyuan · founded 1990

  25. 22

    SingaporeKulicke & Soffa

    The leading maker of wire and ball bonders, now selling fluxless thermo-compression and advanced die-placement tools for chiplet assembly.

    Moderate relevance · Equipment & machinery · Singapore, Singapore · founded 1951

  26. 23

    AustriaEV Group

    The leading supplier of wafer-to-wafer and die-to-wafer hybrid bonding and temporary bonding/debonding systems for 3D integration.

    Moderate relevance · Equipment & machinery · Austria, St. Florian am Inn · founded 1980

  27. 24

    JapanResonac Holdings

    A top supplier of packaging materials (die-attach films, mold compounds, copper-clad laminates) and leader of the JOINT2 consortium for next-generation packaging.

    Moderate relevance · Chemicals & gases · Japan, Tokyo · founded 1939

  28. 25

    JapanShinko Electric Industries

    A major flip-chip substrate and silicon-interposer maker; a consortium led by state-backed Japan Investment Corporation took it private in 2025.

    Moderate relevance · Components & subsystems · Japan, Nagano · founded 1946

  29. 26

    AustriaAT&S

    Europe's leading IC-substrate maker, supplying ABF substrates for AMD processors from its plant in Kulim, Malaysia, and running a substrate R&D line in Leoben.

    Moderate relevance · Components & subsystems · Austria, Leoben · founded 1987

  30. 27

    United StatesOnto Innovation

    Provides panel-level lithography and the inspection and metrology tools used across 2.5D/3D and HBM packaging lines.

    Moderate relevance · Equipment & machinery · United States, Wilmington · founded 2019

  31. 28

    IsraelCamtek

    A leading supplier of inspection and metrology systems for HBM, CoWoS and other advanced-packaging lines, which make up most of its revenue.

    Moderate relevance · Equipment & machinery · Israel, Migdal HaEmek · founded 1987

  32. 29

    GermanySÜSS MicroTec

    Supplies temporary bonders/debonders, hybrid bonders and coaters used in 2.5D/3D and HBM packaging.

    Moderate relevance · Equipment & machinery · Germany, Garching · founded 1949

  33. 30

    TaiwanKing Yuan Electronics (KYEC)

    The largest independent test house, handling final and system-level test of CoWoS-packaged AI accelerators.

    Moderate relevance · Contract manufacturing · Taiwan, Hsinchu · founded 1987

  34. 31

    United StatesCadence Design Systems

    Its Integrity 3D-IC platform and its package and signal-integrity tools are the main EDA flows for designing chiplet and 3D-stacked systems.

    Moderate relevance · Design & engineering software · United States, San Jose · founded 1988 · 13k staff

  35. 32

    Belgiumimec

    Runs one of the world's main 3D system-integration research programmes (hybrid bonding, backside power, chiplets) with foundry, OSAT and equipment partners, and leads an EU Chips Act pilot line.

    Moderate relevance · Research & IP · Belgium, Leuven · founded 1984

  36. Low11 companies
  37. 33

    South KoreaHana Micron

    South Korea's largest independent OSAT, packaging memory for Samsung and SK hynix in Korea and in a large new plant in Bac Giang, Vietnam.

    Low relevance · Contract manufacturing · South Korea, Asan · founded 2001

  38. 34

    ChinaSJ Semiconductor (SJSemi)

    China's leading middle-end bumping and 2.5D/chiplet integration foundry, originally a joint venture of SMIC and JCET.

    Low relevance · Contract manufacturing · China, Jiangyin · founded 2014

  39. 35

    SingaporeUTAC Holdings

    A mid-tier global OSAT with plants in Singapore, Thailand, Malaysia, Indonesia and China, offering wafer-level and SiP packaging and test; Wise Road Capital owns it.

    Low relevance · Contract manufacturing · Singapore, Singapore · founded 1997

  40. 36

    IsraelNova

    Supplies dimensional and chemical metrology used in hybrid-bonding and advanced-packaging process control.

    Low relevance · Equipment & machinery · Israel, Rehovot · founded 1993

  41. 37

    SwitzerlandSTMicroelectronics

    Develops SiP and panel-level packaging in-house and runs back-end plants in Africa and Asia, among them Bouskoura, Morocco, one of Africa's largest semiconductor assembly sites.

    Low relevance · Components & subsystems · Switzerland, Geneva · founded 1987 · 50k staff

  42. 38

    South KoreaSFA Semicon

    A Korean OSAT supplying memory packaging and flip-chip/bumping services, mainly to Samsung, from plants in Korea and the Philippines.

    Low relevance · Contract manufacturing · South Korea, Cheonan · founded 1998

  43. 39

    ChinaShennan Circuits

    China's leading IC-substrate maker (part of the state-owned AVIC group), building ABF/FC-BGA substrate capacity in Guangzhou and Wuxi.

    Low relevance · Components & subsystems · China, Shenzhen · founded 1984

  44. 40

    MalaysiaInari Amertron

    Malaysia's largest listed OSAT by market value, packaging and testing RF front-end and optoelectronic SiP modules, with Broadcom as its main customer.

    Low relevance · Contract manufacturing · Malaysia, Penang · founded 2010

  45. 41

    MalaysiaMalaysian Pacific Industries (Carsem)

    Through its subsidiary Carsem it runs OSAT plants in Ipoh and Suzhou, packaging QFN, flip-chip and SiP for automotive and power devices.

    Low relevance · Contract manufacturing · Malaysia, Kuala Lumpur · founded 1962

  46. 42

    SingaporeAEM Holdings

    Supplies system-level and burn-in test handlers for high-power AI and HPC processors after packaging, with Intel as a major customer.

    Low relevance · Equipment & machinery · Singapore, Singapore · founded 1992

  47. 43

    IndiaTata Electronics

    Building India's largest OSAT at Jagiroad, Assam (about INR 27,000 crore, with wire-bond, flip-chip and integrated-systems packaging) next to its Dholera fab.

    Low relevance · Contract manufacturing · India, Bengaluru · founded 2020

  48. Very low7 companies
  49. 44

    MalaysiaViTrox Corporation

    A Malaysian maker of machine-vision inspection systems for semiconductor packaging and back-end lines, sold to global OSATs.

    Very low relevance · Equipment & machinery · Malaysia, Penang · founded 2000

  50. 45

    ThailandHana Microelectronics

    Thailand's main home-grown semiconductor assembly firm, with IC packaging and test in Ayutthaya and SiC power-module packaging through its Power Master unit.

    Very low relevance · Contract manufacturing · Thailand, Bangkok · founded 1978

  51. 46

    IndiaCG Power and Industrial Solutions

    Through CG Semi, its joint venture with Renesas and Stars Microelectronics, it opened a government-approved OSAT pilot line in Sanand, Gujarat in 2025.

    Very low relevance · Hardware & devices · India, Mumbai · founded 1937

  52. 47

    IndiaKaynes Technology

    Its subsidiary Kaynes Semicon runs a government-backed OSAT in Sanand, Gujarat that began shipping packaged chips in 2025.

    Very low relevance · Contract manufacturing · India, Mysuru · founded 1988

  53. 48

    VietnamFPT Corporation (FPT Semiconductor)

    In January 2026 it launched Vietnam's first locally owned advanced semiconductor testing and packaging plant, in Bac Ninh, with Korean OSAT Winpac as a partner.

    Very low relevance · Professional & data services · Vietnam, Hanoi · founded 1988

  54. 49

    BrazilZilia Technologies

    Formerly SMART Modular Brazil and now controlled by China's Longsys; it packages and tests memory ICs in Atibaia, the largest such operation in Latin America, and is expanding with BNDES financing.

    Very low relevance · Contract manufacturing · Brazil, Atibaia · founded 2006

  55. 50

    BrazilHT Micron

    A joint venture of Brazil's Parit and Korea's Hana Micron that packages and tests DRAM/NAND and IoT chips, and is expanding toward LPDDR5X with BNDES funding.

    Very low relevance · Contract manufacturing · Brazil, São Leopoldo · founded 2009

These companies in the Companies table →