- Headquarters
- Hsinchu, Taiwan · East Asia
- Value chain
- Contract manufacturing(Products)
- What that means
- Makes to others' designs: foundries, contract manufacturers, CDMOs and assembly and test houses.
- Founded
- 1987
- Staff
- 83,825 (2024)
- Ownership
- Listed
- Listing
- TWSE:2330 on Google Finance
- Website
- tsmc.com
- Relevance
- Very high at its strongest, in Advanced Semiconductor Fabrication
Hsinchu, TaiwanIn 6 capabilities
Each capability the company is listed in, most relevant first: how experts in the field see its global relevance there, why it is listed and the source.
- Advanced Semiconductor FabricationVery high
Semiconductors & Advanced Computing · Manufacture · listed #1 of 50
Largest foundry in the world with about two-thirds of foundry revenue; first to volume production at 3nm and 2nm (N2).
Relevance: Dominant leading-edge foundry; sets the process frontier
Semiconductors & Advanced Computing · Manufacture · listed #1 of 50
Runs the 3DFabric platform (CoWoS, InFO, SoIC) that packages almost every leading AI accelerator, including Nvidia and AMD GPUs, and is the largest holder of advanced-packaging capacity.
Relevance: CoWoS and SoIC define advanced AI chip packaging
- High-Performance & AI ComputingVery high
Semiconductors & Advanced Computing · Manufacture · listed #2 of 50
Fabricates nearly all leading-edge AI accelerators and HPC processors (NVIDIA, AMD, Google TPU, AWS Trainium) and supplies the CoWoS advanced packaging that limits global AI chip output.
Relevance: Fabricates and packages nearly all leading AI chips
- Nanomaterials & MetamaterialsVery high
Advanced Materials & Manufacturing · Research · listed #6 of 50
Second-largest international patent applicant in nanotechnology, with research on 2D-material and carbon-nanotube transistors and the world's most advanced nanoscale fabrication.
Relevance: Leading nanoscale device manufacturer and top patent applicant
Sensing, Timing & Navigation · Manufacture · listed #21 of 50
TSMC is the leading foundry for CMOS image sensor and stacked-sensor wafers for fabless vendors, and it is a top-ten international patent applicant in this capability.
Relevance: Leading foundry for stacked CMOS image sensors
Connectivity, Cyber & Trust Technologies · Manufacture · listed #23 of 50
Develops COUPE (Compact Universal Photonic Engine) silicon-photonics integration for co-packaged optics used by NVIDIA and Broadcom.
Relevance: Emerging silicon-photonics integration platform