Contract manufacturing · China

Tongfu Microelectronics

A top-five global OSAT and AMD's main back-end partner (through the former AMD Penang and Suzhou plants), offering chiplet and 2.5D packaging.

Headquarters
Nantong, China · East Asia
Value chain
Contract manufacturing(Products)
What that means
Makes to others' designs: foundries, contract manufacturers, CDMOs and assembly and test houses.
Founded
1997
Ownership
Listed
Listing
SZSE:002156 on Google Finance
Website
tfme.com
Relevance
Moderate at its strongest, in Advanced Packaging & Heterogeneous Integration

In 1 capability

Each capability the company is listed in, most relevant first: how experts in the field see its global relevance there, why it is listed and the source.

  1. Semiconductors & Advanced Computing · Manufacture · listed #11 of 50

    A top-five global OSAT and AMD's main back-end partner (through the former AMD Penang and Suzhou plants), offering chiplet and 2.5D packaging.

    Relevance: Top-five OSAT and AMD's back-end partner

    Source · tfme.com