- Headquarters
- Tokyo, Japan · East Asia
- Value chain
- Equipment & machinery(Tools)
- What that means
- Builds the machines that make things: production, test and measurement equipment, machine tools, printers and lab instruments.
- Founded
- 1937
- Ownership
- Listed
- Listing
- TSE:6146 on Google Finance
- Website
- disco.co.jp
- Relevance
- High at its strongest, in Advanced Packaging & Heterogeneous Integration
Tokyo, JapanIn 3 capabilities
Each capability the company is listed in, most relevant first: how experts in the field see its global relevance there, why it is listed and the source.
Semiconductors & Advanced Computing · Equipment & materials · listed #10 of 50
Dominates precision dicing, grinding and thinning equipment, which every HBM stack and 2.5D/3D package depends on.
Relevance: Dominates dicing, grinding and thinning equipment
Semiconductors & Advanced Computing · Equipment & materials · listed #17 of 50
Dominant maker of wafer dicing saws, laser saws and grinders, essential to thinning and singulating wafers for HBM and advanced packaging.
Relevance: Dominant dicing and grinding equipment maker
Semiconductors & Advanced Computing · Equipment & materials · listed #34 of 50
Dominant supplier of the wafer dicing, grinding and thinning equipment needed for HBM stacking and advanced packaging.
Relevance: Dominant dicing and grinding equipment supplier