Components & subsystems · United States

Micron Technology

Third-largest DRAM maker, first to ship 1-beta DRAM, and building new leading-edge memory fabs in Idaho and New York.

Headquarters
Boise, United States · North America
Value chain
Components & subsystems(Inputs)
What that means
Makes the parts others build into products: chips, sensors, optics, modules, engines and subsystems.
Founded
1978
Staff
48,000 (2024)
Ownership
Listed
Listing
Nasdaq:MU on Google Finance
Website
micron.com
Relevance
High at its strongest, in Advanced Semiconductor Fabrication

In 3 capabilities

Each capability the company is listed in, most relevant first: how experts in the field see its global relevance there, why it is listed and the source.

  1. Semiconductors & Advanced Computing · Manufacture · listed #11 of 50

    Third-largest DRAM maker, first to ship 1-beta DRAM, and building new leading-edge memory fabs in Idaho and New York.

    Relevance: Top-three DRAM maker with advanced memory processes

    Source · en.wikipedia.org

  2. Semiconductors & Advanced Computing · Equipment & materials · listed #13 of 50

    The only US maker of DRAM and HBM; it supplies HBM3E for NVIDIA and AMD accelerators.

    Relevance: Major HBM and DRAM supplier

    Source · en.wikipedia.org

  3. Semiconductors & Advanced Computing · Manufacture · listed #18 of 50

    Stacks HBM3E memory for Nvidia accelerators and is building HBM packaging capacity in Taiwan, Singapore and its Sanand ATMP plant in India.

    Relevance: HBM stacking for AI accelerators

    Source · micron.com